Engineering 8D vs Reliability Pro

Engineering 8D is designed for fast, structured engineering problem solving and professional documentation. The app’s primary goal is to support disciplined, systematic thinking throughout the problem-solving process. It can also be used for incident reporting, rapid preparation of preliminary data for urgent meetings, creating team lists, managing engineering action items, and similar operational needs. A built-in 8D tutorial project is automatically added to the project list upon first installation (clean install required). Each project in the project list can be duplicated for faster reuse and consistency. Reporting Capabilities • The content of the full report can be customized using the settings options. • A complete report preview is generated when the Report button is pressed. • Each section also includes its own dedicated report button for partial reporting. • Users can upload and save project-specific logo images by tapping the logo area on the notification page. Supported 8D Sections 1. Notice Report with an editable photo 2. Team Management Table 3. 5W2H and Ishikawa (Cause–Effect) Diagrams 4. Root Cause Analysis, including 5 Why Analysis 5. Action Table covering containment, corrective, and preventive actions in a single organized view 6. Preventing Recurrence Report, including review of similar systems and processes 7. Document Review Table 8. Team Recognition Report Data Editing & Reuse Any previously entered record in a table can be recalled into the entry fields by selecting its row. After editing, changes can be saved or recorded as a new entry using the action buttons. Help & Guidance Context-specific help content is available in the Settings tab of each project.

Reliability Pro is a complete reliability, quality, and design-engineering workbench in your pocket — 165+ professional tools that normally live in expensive desktop software, ready in seconds. A problem that takes an hour on a desktop takes seconds here. CORE CAPABILITIES Life data analysis — Weibull and lognormal fitting, censoring, confidence bounds Accelerated life testing — Arrhenius, Coffin-Manson, and Power Law System modeling — reliability block diagrams, fault trees, and event trees Failure analysis — FMEA, FMECA, and FRACAS Statistics & DOE — ANOVA, regression, and a side-by-side plan-and-analyze DOE workbench Quality & SPC — control charts, process capability, Gage R&R, acceptance sampling Monte Carlo simulation Live sensor diagnostics — vibration, acoustic, shock, and motion NEW — RELIABILITY-CENTERED MAINTENANCE Decide what maintenance each failure mode needs, then set the interval: RCM Decision Worksheet — consequence and task-selection logic after SAE JA1011 Optimal Replacement Interval — the lowest-cost replacement age from Weibull data P-F Interval Planner — how often to inspect for condition monitoring Failure-Finding Interval — test intervals for relief valves, trips, and alarms Maintenance Strategy Comparison — run-to-failure vs time-based vs condition-based 2D FIELD SOLVERS Screen a real design, not just a formula — physics-of-failure solvers that feed a life model: Thermal CFD — board hot spots under airflow Thermal Cycling — solder-joint fatigue Moisture Ingress — popcorn-cracking risk Current-Density Field — electromigration from current crowding Enclosure Convection, Forced-Air Cooling, and Liquid Cold-Plate Galvanic Corrosion — penetration rate for dissimilar-metal joints DESIGN FOR RELIABILITY 45+ design-stage calculators, each framed by the failure mechanism it prevents: Fluids & flow — pressure drop, NPSH, valve sizing, water hammer, flow-induced vibration, two-phase flow Mechanical & structural — bolted joints, beam deflection, column buckling, Mohr's circle, tolerance stack-up Electrical & PCB — trace width, voltage drop, RC/RLC damping, battery runtime, creepage and clearance, derating Thermal — junction temperature, heat sinks, transient response, heat exchangers, fin efficiency, dew point Chemical & materials — corrosion rate, galvanic compatibility, MSL floor life Optical & photonics — fibre link budget, LED lumen maintenance, illuminance SEMICONDUCTOR RELIABILITY Electromigration, gate-oxide TDDB, BTI/HCI, die-attach and flip-chip fatigue, wirebonds, popcorn cracking, HTOL FIT, and acceleration factors WHO IT'S FOR Reliability, quality, maintenance, and design engineers; Six Sigma practitioners; students; and anyone who needs trustworthy results fast. WHAT YOU GET Every tool opens with a realistic example dataset Compare candidate models ranked by R² and AICc in curve fitting, degradation, and life-data analysis Basic Statistics tools are free for everyone; try any premium tool 5 times before signing in AI assistant and search to jump to the right tool Step-by-step video tutorials A reference library with theory, worked examples, key equations, and citations for every tool Import data and export a professional PDF report with theory, equations, a worked example, results, charts, and references Methods drawn from textbook formulas and published standards, with assumptions stated in every tool Missing a tool? Suggest one from inside the app SUBSCRIPTION Full access to all tools is available via an auto-renewing subscription (monthly or annual). Payment is charged to your Apple Account at confirmation of purchase. Your subscription renews automatically unless cancelled at least 24 hours before the end of the current period. Manage or cancel anytime in your Account settings. Privacy Policy: https://victorkunadian-web.github.io/privacy/ Terms of Use (EULA): https://www.apple.com/legal/internet-services/itunes/dev/stdeula/