DesignCon 2026 vs IMAPS Conferences

DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. Attend the expertly curated 15-track conference created by engineers for engineers featuring technical paper sessions, tutorials, and industry panels covering all aspects of chip, board, and systems design. Browse exhibits with hundreds of new products and technologies in the expo hall, attend educational sessions in the Chiphead Theater, see interactive demos, and network with high-caliber industry professionals at multiple social functions. DesignCon's "Engineer of the Year" Award is given out each year during the DesignCon event. The award seeks to recognize the best of the best in engineering and new product advancements at the chip, board, or system level. The award winner is selected based on his or her leadership, creativity, and out-of-the-box thinking brought to design/test of chips, boards, or systems, with particular attention paid to areas of signal and power integrity.

TripBuilder Multi Event Mobile™ is the mobile application for the International Microelectronics Assembly and Packaging Society Events. Use this app to: • Easily view event info and more right on your mobile phone for the each event. • Connect with Attendees, Exhibitors and Speakers at the event. • Maximize your time at the Event with the MyEvent personalization tools. This TripBuilder Multi Event Mobile™ app is provided at no charge by the International Microelectronics Assembly and Packaging Society. It was designed and developed by TripBuilder Media Inc. If you have any questions, or need any support regarding how to use this app, please submit a Support Ticket (located within the Help icon in the app).